الرئيسية › دليل الباحثين › A. Benali

A. Benali

الانتماء : Georgia Institute of Technology

• 7منشورات (انتماء مغربي)
• 9مجموع المنشورات
• 65الاستشهادات
• 4مؤشر h

ORCIDOpenAlex

مجالات البحث

• 3D IC and TSV technologies
• Electronic Packaging and Soldering Technologies
• Advanced MEMS and NEMS Technologies
• Integrated Circuits and Semiconductor Failure Analysis
• Microwave Engineering and Waveguides

المنشورات (7)

• Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy
  2016 · IEEE Electronic Components and Technology Conference (ECTC) · استُشهد به 3 مرة
• Analytical and finite element modeling of through glass via thermal stress
  2015 · Microelectronic Engineering · استُشهد به 26 مرة
• Electrical performance of glass interposer-based 3D packaging: Modeling and simulations
  2015 · International Conference on Electrical and Information Technologies · استُشهد به 3 مرة
• A study of through package vias in a glass interposer for multifunctional and miniaturized systems
  2014 · Microelectronics Reliability · استُشهد به 18 مرة
• Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress
  2013 · International Design and Test Workshop (IDT) · استُشهد به 8 مرة
• Glass Interposer Reliability Improvement by Transient Thermal Modelling and Physical Analysis
  2013 · Proceedings - International Symposium for Testing and Failure Analysis · استُشهد به 4 مرة
• A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera
  2013 · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · استُشهد به 3 مرة

مجلات النشر

• IEEE Electronic Components and Technology Conference (ECTC) × 1
• Microelectronic Engineering × 1
• International Conference on Electrical and Information Technologies × 1
• Microelectronics Reliability × 1
• International Design and Test Workshop (IDT) × 1
• Proceedings - International Symposium for Testing and Failure Analysis × 1

المنشورات حسب السنة

• 20161
• 20152
• 20141
• 20133

التعاون العلمي

المؤسسات الشريكة : International University of Rabat · Université Ibn-Tofail · University of Leeds · Abdelmalek Essaâdi University

بلدان المؤلفين المشاركين : الولايات المتحدة · المملكة المتحدة

المؤلفون المشاركون

• Moshine Bouya
• Mounir Ghogho
• Mustapha Faqir
• Abderrahim El Amrani
• Abdelkader Hadjoudja
• Abdellatif Ben Abdellah
• Yassine Bouissa
• Zouhair Sbiaa
• Laâmari Hlou
• Mohamed El Bouhali
• Y. Benlahoucine

البيانات البيبليوغرافية مصدرها OpenAlex (قاعدة مفتوحة).