Accueil › Annuaire des chercheurs › A. Benali

A. Benali

Affiliation : Georgia Institute of Technology

• 7Publications (affiliation marocaine)
• 9Publications au total
• 65Citations
• 4Indice h

ORCIDOpenAlex

Domaines de recherche

• 3D IC and TSV technologies
• Electronic Packaging and Soldering Technologies
• Advanced MEMS and NEMS Technologies
• Integrated Circuits and Semiconductor Failure Analysis
• Microwave Engineering and Waveguides

Publications (7)

• Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy
  2016 · IEEE Electronic Components and Technology Conference (ECTC) · cité 3 fois
• Analytical and finite element modeling of through glass via thermal stress
  2015 · Microelectronic Engineering · cité 26 fois
• Electrical performance of glass interposer-based 3D packaging: Modeling and simulations
  2015 · International Conference on Electrical and Information Technologies · cité 3 fois
• A study of through package vias in a glass interposer for multifunctional and miniaturized systems
  2014 · Microelectronics Reliability · cité 18 fois
• Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress
  2013 · International Design and Test Workshop (IDT) · cité 8 fois
• Glass Interposer Reliability Improvement by Transient Thermal Modelling and Physical Analysis
  2013 · Proceedings - International Symposium for Testing and Failure Analysis · cité 4 fois
• A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera
  2013 · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · cité 3 fois

Revues de publication

• IEEE Electronic Components and Technology Conference (ECTC) × 1
• Microelectronic Engineering × 1
• International Conference on Electrical and Information Technologies × 1
• Microelectronics Reliability × 1
• International Design and Test Workshop (IDT) × 1
• Proceedings - International Symposium for Testing and Failure Analysis × 1

Publications par année

• 20161
• 20152
• 20141
• 20133

Collaborations

Établissements partenaires : International University of Rabat · Université Ibn-Tofail · University of Leeds · Abdelmalek Essaâdi University

Pays des co-auteurs : États-Unis · Royaume-Uni

Co-auteurs

• Moshine Bouya
• Mounir Ghogho
• Mustapha Faqir
• Abderrahim El Amrani
• Abdelkader Hadjoudja
• Abdellatif Ben Abdellah
• Yassine Bouissa
• Zouhair Sbiaa
• Laâmari Hlou
• Mohamed El Bouhali
• Y. Benlahoucine

Données bibliographiques issues d’OpenAlex (base ouverte).