A. Benali

Affiliation : Georgia Institute of Technology

7Publications (affiliation in Morocco)
9Total publications
65Citations
4h-index

Research profile

A. Benali has 7 indexed publications (2013–2016). Their work appears mainly in “IEEE Electronic Components and Technology Conference (ECTC)”, “Microelectronic Engineering” and “International Conference on Electrical and Information Technologies”. Their most cited article, “Analytical and finite element modeling of through glass via thermal stress” (2015), has been cited 26 times. 4 of these publications date from the last three years of activity. Their work is co-authored with at least 11 researchers, including institutions in United States, United Kingdom.

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Research areas

3D IC and TSV technologies
Electronic Packaging and Soldering Technologies
Advanced MEMS and NEMS Technologies
Integrated Circuits and Semiconductor Failure Analysis
Microwave Engineering and Waveguides

Publications (7)

Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy
2016 · IEEE Electronic Components and Technology Conference (ECTC) · cited 3 times
Analytical and finite element modeling of through glass via thermal stress
2015 · Microelectronic Engineering · cited 26 times
Electrical performance of glass interposer-based 3D packaging: Modeling and simulations
2015 · International Conference on Electrical and Information Technologies · cited 3 times
A study of through package vias in a glass interposer for multifunctional and miniaturized systems
2014 · Microelectronics Reliability · cited 18 times
Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress
2013 · International Design and Test Workshop (IDT) · cited 8 times
Glass Interposer Reliability Improvement by Transient Thermal Modelling and Physical Analysis
2013 · Proceedings - International Symposium for Testing and Failure Analysis · cited 4 times
A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera
2013 · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · cited 3 times

Publication venues

IEEE Electronic Components and Technology Conference (ECTC) × 1
Microelectronic Engineering × 1
International Conference on Electrical and Information Technologies × 1
Microelectronics Reliability × 1
International Design and Test Workshop (IDT) × 1
Proceedings - International Symposium for Testing and Failure Analysis × 1

Publications per year

20161
20152
20141
20133

Collaborations

Partner institutions : International University of Rabat · Université Ibn-Tofail · University of Leeds · Abdelmalek Essaâdi University

Co-authors’ countries : United States · United Kingdom

Co-authors

Bibliographic data from OpenAlex (open database).