Home › Researcher directory › Dan J. Lim

Dan J. Lim

Affiliation : Université des Sciences et de la Technologie d'Oran Mohamed Boudiaf

1Publications (affiliation in Algeria)
2Total publications
2Citations
1h-index

Research profile

Dan J. Lim has 1 indexed publication (2003). Their work appears in “Circuit World”. Their most cited article, “A three‐dimensional transmission line matrix (TLM) simulation method for thermal effects in high power insulated gate bipolar transistors” (2003), has been cited 2 times. Their work is co-authored with at least 2 researchers.

Is this you? Get your research seen

Create your free DzCademia profile and add your articles: they will show up more easily on Google and in AI assistants like ChatGPT, so more people can read and cite your work.

Create my free profile Add my publications

Research areas

Silicon Carbide Semiconductor Technologies
Heat Transfer and Numerical Methods
Electronic Packaging and Soldering Technologies
Thermal Analysis in Power Transmission

Publications (1)

A three‐dimensional transmission line matrix (TLM) simulation method for thermal effects in high power insulated gate bipolar transistors
2003 · Circuit World · cited 2 times

Collaborations

Partner institutions : École Nationale Polytechnique d'Oran

Co-authors

Bibliographic data from OpenAlex (open database).